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Integrated Systems And Specialized Vehicles
Integrated Systems And Specialized Vehicles
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HIRAIN Wins "2025 Automotive Chip Ecosystem Empowerment Product" Award
Release time:
2025-05-09 15:02
Recently, at the "China Chip" exhibition area of the 21st Shanghai International Automobile Industry Exhibition, the China Automotive Chip Industry Innovation Strategic Alliance and China Electronics News jointly announced the "2025 China Automotive Chip Industry Innovation Achievements" and held an awards ceremony. HIRAIN’s independently developed AUTOSAR-based software platform INTEWORK-EAS was honored with the "2025 Automotive Chip Ecosystem Empowerment Product" Award.
The 2025 China Automotive Chip Industry Innovation Achievements selection evaluated 104 innovative submissions from 74 organizations nationwide. The judging committee, composed of experts in automotive electronics and chip R&D, conducted rigorous screening using a back-to-back independent scoring mechanism. Only 36 entries received awards, with merely four in the "Ecosystem Empowerment Product" category. HIRAIN's INTEWORK-EAS stood out for its excellence in core technology breakthroughs, collaborative ecosystem development, and large-scale adoption of domestic chips. This recognition not only highlights industry acclaim for its full-stack AUTOSAR solutions but also underscores HIRAIN’s pivotal role in accelerating the industrialization of domestic automotive chips.
HIRAIN's INTEWORK-EAS is a full-stack AUTOSAR (AUTomotive Open System ARchitecture) software solution tailored for automotive electronics development. It supports both MCU and MPU scenarios, offering AUTOSAR-compliant CP and AP platform solutions, along with functional safety assurance via the EAS.Safety Library and cybersecurity compliance through the EAS.HSM solution, which meets Evita Full-level requirements.
In recent years, HIRAIN has actively contributed to building a domestic chip ecosystem. INTEWORK-EAS now supports over 40 chip models from more than 20 domestic manufacturers. The platform also provides pre-configured AUTOSAR libraries for domestic chips, reducing the adaptation cycle for OEMs/Tier1s when transitioning to domestic chips and enhancing integration efficiency. To address safety demands, the EAS team developed functional safety libraries based on manufacturer guidelines, enabling single-point and latent fault diagnostics and reporting to meet advanced safety standards. Additionally, HIRAIN has built HSM firmware and Host-side AUTOSAR Crypto modules compliant with ISO/SAE 21434 for multiple domestic chips, ensuring compatibility with third-party AUTOSAR toolchains.
Moving forward, HIRAIN will continue to collaborate with the China Automotive Chip Industry Innovation Strategic Alliance, adhering to its philosophy of “Value Innovation, Customer Focus.” By driving technological innovation and fostering ecosystem synergy, HIRAIN aims to partner with industry stakeholders to build a secure and self-reliant automotive chip ecosystem, injecting stronger momentum into the globalization of China’s automotive electronics industry.