HIRAIN Basic Software Empowers the DF30 Chip for National Production

On November 9th, the Hubei Province Vehicle Grade Chip Industrial Technology Innovation Consortium (hereinafter referred to as the "Innovation Consortium") held its 2024 annual conference in Wuhan, where the domestically developed, controllable high-performance vehicle-grade MCU chip DF30 was officially launched. HIRAIN was invited to attend the conference and officially joined the Innovation Consortium, collaborating with member units to contribute to the development of the intelligent connected vehicle industry.

The DF30 chip, introduced by Dongfeng Motor R&D Institute, marks a new breakthrough in the domestic vehicle-grade chip field. It features an independent open-source RISC-V multi-core architecture, developed with domestic 40nm vehicle-grade process technology, with a functional safety level reaching ASIL-D, and is characterized by "high performance, strong controllability, ultra-security, and extreme reliability." This chip has undergone 295 rigorous tests and is compatible with HIRAIN's independently developed AUTOSAR automotive operating system, widely applied in powertrain control, vehicle chassis, electronic information, and driving assistance systems.

At the conference, Zhao Yan'an, HIRAIN's Chief Technology Officer, delivered a keynote speech titled "AUTOSAR OS Technology Practice Based on RISC-V Architecture." He provided an in-depth introduction on how to implement key resources from the RISC-V instruction set to the chip, and then to the AUTOSAR OS that meets functional safety standards, showcasing HIRAIN's technical strength and innovative practice in the field of vehicle-grade operating systems.

In response to the evolving R&D needs of the current era, HIRAIN has independently developed software products that comply with AUTOSAR standards and various mainstream OEM customization standards - the INTEWORK-EAS family. This series includes AUTOSAR Adaptive Platform products, AUTOSAR Classic Platform products, and a full-stack R&D tool chain, aimed at providing domestic autonomous basic software solutions for the development of various controllers distributed throughout the vehicle.

HIRAIN's AUTOSAR INTEWORK-EAS CP and AP products

AUTOSAR OS is one of the key components of AUTOSAR, and HIRAIN's AUTOSAR OS (EAS.OS) can meet the demands of modern automotive electronics complex application scenarios in terms of real-time performance and functional safety. With EAS.OS, developers no longer need to focus on complex system scheduling, but can concentrate on the implementation of the functionality of each task, thereby simplifying the application development process. In addition to system scheduling, EAS.OS also supports interrupt and task management, event management, resource management, application partitioning, time protection, memory protection, service protection, and multi-core deployment, among other features, while supporting different compliance classes such as SC1, SC2, SC3, SC4, allowing users to tailor according to different functional needs to fit chips with varying resource conditions.

Currently, HIRAIN's EAS.OS has successfully adapted to a variety of cores including RISC-V, PowerPC, ARM, TriCore, RH850, ARC, and more, supporting over 80 chip models. Focusing on domestic chips, HIRAIN adheres to the cooperative philosophy of open win-win, establishing cooperative relationships with several chip manufacturers to jointly promote the construction of the domestic chip and software ecosystem.

As a new member of the Innovation Consortium, HIRAIN feels honored, which is a full affirmation of our continuous innovation and outstanding contribution in the field of vehicle-grade chips. In the future, HIRAIN will continue to increase R&D efforts, deepen technological innovation, and work with member units to build an automotive chip ecosystem, and co-create and share to empower the development of the intelligent connected vehicle industry.