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Integrated Systems And Specialized Vehicles
Integrated Systems And Specialized Vehicles
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Industrial Intelligence
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Intelligent Transportation
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Self-Developed Power Module
Overview
Hirain's self-developed high-performance SiC power module, featuring ultra-low stray inductance design, high-efficiency thermal architecture, safety insulation technology, embedded current sampling, and advanced packaging processes, achieves compatibility across 400V-1500V full voltage platforms. It delivers ultra-high current output capability, exceptional power density, superior efficiency, and a high level of integration. Through innovative technology, it reduces SiC die usage by 25%, significantly lowering system costs while enhancing reliability and energy efficiency. This provides a more efficient, compact, and cost-effective solution for electric vehicles and other application fields.
Key Features/Technologies
- Full Voltage Platform Compatibility: Supports 400V-1500V wide voltage range, flexibly meets high-voltage system requirements, and covers diverse automotive-grade application scenarios.
- High Peak Current Output Capability: Efficient thermal design enables ultra-high current output capability of 400-600Arms, withstanding extreme vehicle operating conditions.
- High Power Density: Highly integrated compact structural design delivers greater power output in a smaller volume, contributing to electric drive system light-weighting and space optimization.
- SiC Usage Optimization: Module performance optimization and packaging innovation reduce SiC die requirements by 25% for equivalent output capacity, achieving competitive cost control.
- Safe Insulation Design: Compliant with IEC60664.1 automotive insulation standards. Creepage distance and electrical clearance designs withstand 1500V high voltage, ensuring system safety.
- Ultra-Low Stray Inductance: Utilizes laminated busbars and copper clip packaging technology, achieving module stray inductance ≤5 nanohenry, significantly reducing dynamic losses and enhancing system efficiency and range performance.
- Efficient Thermal Design: Comprehensive optimization of structure, flow field, and layout reduces thermal resistance by 30%, improves heat dissipation capability, and ensures stable module operation.
- Long Lifespan & High Reliability: Employs silver sintering and copper clip interconnection technology, achieving power cycling lifespan exceeding conventional processes by over 2 times, suitable for harsh application environments.
- Extreme Environment Adaptability: Epoxy resin potting material ensures high-voltage sealing. Supports operation at junction temperatures from -40°C to 200°C and exhibits excellent vibration resistance, meeting flexible mounting requirements (e.g., side-mounted/upside-down).
- Laser Welding Process: Power terminals utilize laser welding, reducing stray inductance, enhancing current conduction capability, and ensuring long-term system reliability.
- Highly Integrated Design: Integrates current sampling function, reducing volume by 20% compared to traditional modules, providing greater design flexibility and cost advantages for applications.
- Integrated Brick Solution: Supports customizable inverter brick solutions (module, capacitor and cold plate), enabling rapid response to customer needs and shortening development cycles.
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