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Integrated Systems And Specialized Vehicles
Integrated Systems And Specialized Vehicles
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Industrial Intelligence
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Intelligent Transportation
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Jingwei Hirain teams up with Sanechips to accelerate AI-powered cockpit and autonomous driving integration, redefining the in-cabin experience.
Release time:
2026-02-03 13:38
On February 2, 2026, Jingwei Hirain and Sanechips officially signed a strategic cooperation agreement. Moving forward, based on a shared vision for the development of the intelligent automotive industry, the two parties will focus on cutting-edge fields such as intelligent connectivity, intelligent driving, and intelligent cockpit to carry out in-depth collaborative innovation and jointly develop integrated core hardware and software solutions for smart vehicles. Additionally, both sides will explore the deep integration and innovative application of AI and large language model technologies in areas like intelligent driving and intelligent cockpit, providing more advanced solutions for automotive intelligence.
At present, with the evolution of automotive electronic and electrical architectures, high-performance centralized computing platforms and cross-domain integrated functions are rapidly materializing, placing higher demands on the diversified capabilities, rapid iteration capacity, cost control, and supply chain security of computing platforms. Through this collaboration, Jingwei Hirain will leverage its extensive expertise in automotive electronic hardware and software development, system integration, and engineering mass production, combined with Sanechips’ advanced technologies in automotive-grade high-performance SoC chips for "connectivity + computing," to jointly develop domestic solutions that are safer and more cost-effective. These solutions will cover various scenarios including intelligent cockpit, intelligent driving, cockpit-driving integration, central computing, and T-Box. Both parties aim to build an open ecosystem spanning from underlying chips, operating systems, and middleware to upper-layer applications, accelerating technological innovation from chips to systems.
Jingwei Hirain and Sanechips have long maintained robust technical exchanges and project collaborations in the automotive electronics field. The establishment of this strategic partnership marks a new phase in their relationship. Moving forward, the two sides will capitalize on the strengths of their industrial ecosystem partners in software and algorithms, automotive-grade high-performance SoC chips, domain controller products, and system integration to provide global automotive industry clients with more competitive products and services backed by resilient supply chains. Together, they will promote the development and growth of China’s smart and connected vehicle industrial ecosystem.
▎ About Sanechips
Sanechips is a globally leading IC design company and a dedicated chip subsidiary of ZTE. In the automotive electronics sector, Sanechips positions itself as a provider of foundational capabilities for intelligent connected vehicles and a partner in independent innovation and high-performance domestic solutions. Centered on the "Connectivity + Computing" strategy, Sanechips has proactively developed a portfolio including the cockpit-driving-control integrated central computing SoC chip series "Lanyue" A, the central computing platform SoC chip series "Hanyu" M, and the intelligent connected 5G-V2X communication chip series S with supporting solutions. These products have achieved mass production or designated adoption in brands such as FAW Group, SAIC Motor, and GAC Group, delivering a "software-hardware collaboration, open-decoupled" intelligent connected digital foundation for China's smart automotive industry.
▎ About Jingwei Hirain
Established in 2003, Jingwei Hirain aspires to become a world‑class electronic system technology service provider and has long been deeply engaged in the automotive and intelligent transportation sectors. Upholding the philosophy of "Value Innovation, Customer Service," we focus on offering global clients a one‑stop solution covering automotive electronics products, R&D services, intelligent transportation systems, large assemblies, and special vehicles. With Beijing as its global headquarters, the company has built an integrated operational chain encompassing R&D, production, sales, and service. Leveraging R&D and service centers distributed across China, the United States, and Germany, as well as modern production bases in Tianjin, Nantong, Nanchang, and Malaysia, we are committed to enabling rapid technology iteration and agile localized services. Through this global presence, we consistently deliver reliable, innovative, and efficient technological services to the worldwide market, partnering with customers to drive the future of smart mobility and transportation.