Hirain and YASC Form Strategic Partnership to Jointly Promote SiC Module Applications in New Energy Vehicles
Release time:
2025-06-11 16:10
Recently, Hirain and Anhui YASC Semiconductor Co., Ltd. (hereinafter referred to as "YASC") successfully signed a strategic cooperation agreement. In the future, both parties will fully leverage their respective resource advantages in automotive powertrain and silicon carbide (SiC) power semiconductors. They will jointly advance the automotive-grade certification process, mass production, and delivery of domestically produced SiC modules, thereby fostering the high-quality development of the new energy vehicle (NEV) industry.
In recent years, with the application and promotion of 800V high-voltage platforms, the market for automotive SiC has experienced sustained and rapid growth. However, although China's SiC industry has accelerated its localization process with policy support, it still faces challenges such as technological gaps, patent barriers, and difficulties in automotive-grade certification. Driven by both policy and market demand, the period from 2025 to 2030 will be a critical phase for the explosive growth of China's SiC industry.
Through this collaboration, the two parties will establish a strategic partnership characterized by complementary advantages, resource sharing, and mutual development. They will fully utilize Hirain's years of technical expertise and mature product experience in the automotive powertrain domain, combined with YASC's vertical integration advantages in the SiC power semiconductor field. Together, they will develop high-performance SiC power modules and jointly promote the optimization, productization, automotive-grade testing and certification, as well as mass production and delivery of these modules.
"Amidst the rapid iteration of new energy vehicles, high-performance SiC power modules have become the commanding height of industrial competition. YASC, as one of the leading domestic companies in the SiC semiconductor field, possesses vertical technology integration capabilities spanning materials, chips, to modules. This highly complements Hirain's system-level development experience, delivery capabilities, and global automotive customer resources in the NEV powertrain domain," stated Ji Yingcun, Chairman of Hirain. "This cooperation is not only a 'synergy of strengths' in technological capabilities but also a benchmark for collaborative innovation across the upstream and downstream of the domestic automotive supply chain. We will jointly define the performance boundaries of automotive-grade SiC modules and, through rapid validation and production capacity coordination, commit to providing global automakers with solutions that combine technological leadership and supply chain resilience."
Zhuang Dan, Executive Director and President of Grand Fiber Optic and Chairman of YASC, emphasized: "As one of the leading local automotive electronics system technology service providers, Hirain has accumulated profound expertise and holds significant industry influence in the automotive powertrain field. This cooperation is of great strategic importance. YASC will take this opportunity to further strengthen technological innovation, accelerate breakthroughs in core technologies for domestic automotive-grade chips, collaborate with industry partners to enhance product quality, and promote the synergistic development of the automotive chip industry."
▎ About Hirain
Hirain (Stock Code: 688326), founded in 2003, specializes in providing electronic products, R&D services, and high-level intelligent driving integrated solutions for clients in the automotive and unmanned transportation sectors. The company has established R&D centers and modern production facilities in Tianjin, Nantong, and Malaysia, forming a comprehensive system covering R&D, production, marketing, and service. Adhering to the philosophy of "Value Innovation, Customer Service," Hirain pursues strategies of "Professional Focus," "Technology Leadership," and "Platform Development." It is committed to becoming an internationally renowned comprehensive electronic system technology service provider, a full-stack solutions supplier for intelligent connected vehicles, and a leader in high-level intelligent driving MaaS solutions.
▎ About YASC
YASC is an enterprise dedicated to the R&D and manufacturing of silicon carbide (SiC) power semiconductor products. It possesses full industrial chain capabilities from epitaxial growth, device and module design, wafer manufacturing, to module packaging and testing. The company owns first-class 6/8-inch compatible production line equipment and advanced supporting systems. It offers a full range of SiC SBD and MOSFET products, spanning from industrial-grade to automotive-grade, widely covering applications in new energy vehicles, photovoltaics, energy storage, charging piles, and power grids.