First Mass Production Delivery! Hirain × Axera: The M57 "Domestic Chip" IFC Leads the New Era of L2 Regulation
Release time:
2026-09-18 11:04
Foreword: GB 47955—2026, Intelligent and Connected Vehicle—Safety Requirements of Combined Driver Assistance System, will soon take effect, establishing a unified safety baseline for combined driver assistance systems. Since the beginning of 2026, the market penetration rate of new passenger cars equipped with combined driver assistance functions has reached 70%, and L2-level features are becoming a core consideration for consumers when purchasing vehicles. OEMs need a system solution that balances localization rate, regulatory compliance, and mass-production reliability—one that not only ensures an independent and controllable local supply chain, but also withstands the test of large-scale production.
Recently, Hirain Technologies' Intelligent Front Camera (IFC), built on a domestically developed SoC chip, has officially entered mass production and delivery. Based on the Axera M57 chip, the product adopts a highly integrated single-chip architecture combining the SoC and MCU, and is developed specifically for China's combined driver assistance market. It enables OEMs to rapidly carry out vehicle model adaptation, function tuning, regulatory validation, and scaled mass production.

▎Domestic Chip Solution: An Independent and Controllable Supply Chain
The product is built on the Axera M57 chip and supports 100% domestic sourcing of core materials. Developed by Axera, a globally leading supplier of AI inference SoCs, the chip is purpose-designed for in-vehicle assisted driving scenarios. With high computing power, low power consumption, and automotive-grade reliability, it provides stable and efficient edge computing capability for driver assistance systems. Against the backdrop of ongoing restructuring in the automotive supply chain, a fully domestic SoC solution helps OEMs improve supply security and responsiveness. For OEMs with annual sales in the millions of units, independence and control at the SoC level is not merely a supply chain issue—it is a strategic guarantee of sustained product delivery.
▎Highly Integrated Single-Chip Architecture: Greater Energy Efficiency and Competitiveness
Conventional combined driver assistance solutions typically rely on a dual-chip SoC + MCU architecture, which entails high hardware complexity and limited system integration. Hirain's M57 IFC adopts the M57 single-chip solution, further simplifying the hardware architecture and reducing the number of peripheral components. Compared with dual-chip solutions, overall power consumption is reduced by approximately 20%. While improving integration, it effectively optimizes system complexity, providing a more competitive hardware platform for the widespread adoption of L2 combined driver assistance systems.
▎Developed for the New National Standard: Accelerated Compliance
GB 47955—2026 sets out systematic requirements for combined driver assistance systems in terms of functional requirements, data recording, driver status monitoring, human-machine interaction, system safety assurance, and testing and validation. Hirain's M57 IFC is developed around this standard, achieving coordination among hardware architecture design, algorithm capability, system safety, and regulatory compliance. OEMs can directly use this platform to develop, test, validate, and certify L2-level combined driver assistance systems, accelerating the process from vehicle development to regulatory announcement and market access.
▎From Mass Production Experience to Localized Application
Hirain has been deeply engaged in the driver assistance field for more than 13 years. Its Intelligent Front Camera product family has over 10 years of mass production experience, with cumulative shipments exceeding 5 million units—of which more than 2 million units have been supplied for overseas models, whose equipped vehicles have earned five-star Euro NCAP safety ratings.
The mass production of the M57 IFC marks a key step forward in Hirain's localized product strategy. Relying on a domestic chip platform, a highly integrated system architecture, and function development experience proven in international markets, Hirain is able to provide OEMs with full-process support covering product development, system commissioning, regulatory adaptation, and mass production delivery.
In this market window of accelerating adoption of combined driver assistance, realizing the functions is only the starting point. Meeting market access requirements, achieving rapid mass production and delivery, and adapting to evolving regulations and market demands—these are all mandatory questions for the mass production of driver assistance products. With a more stable domestic supply chain foundation, a more open development model, and consistently efficient mass production and delivery capability, the Hirain M57 IFC helps OEMs seize the challenges and opportunities in China's L2 combined driver assistance market. Looking ahead, Hirain will continue to deepen its expertise in intelligent driving and work hand in hand with OEMs and ecosystem partners to build a safer, smarter mobility future.